Products:

BGA:
0.3 mm Pitch CSP
0.4 mm Pitch CSP
0.5 mm Pitch CSP
0.65 mm Pitch CSP
0.75 mm Pitch CSP
0.80 mm Pitch CSP
1.0 mm Pitch
1.27 mm Pitch
Memory Sockets

Contact Technology:
Buckling Beam
Pinch Style

Dual Pinch Style : Dual pinch style contacts are available in off–set and in–line. The contacts, which open to allow package insertion, touch the solder ball above the equator when closed. These contacts are typically used for 0.5 mm pitch and above.

Buckling Beam Style : For finer pitch packages (0.5 mm and below) Sensata Interconnection has developed a series of buckling beam contacts which can be used in the design of both through–hole and compression mount sockets.

To learn more, please contact us »

0.5 mm Pitch BGA CSP (PDF)
4/26/05, 720KB, 2 Pages

Logic (PDF)
4/26/05, 3.3MB, 6 Pages

Memory (PDF)
4/26/05, 2.1MB, 4 Pages